Case Study

F_CS_Semiconductor_CoolingSystem

Custom Manifold Keeps Electronics Device Cool

F_CS_Semiconductor_CoolingSystem

Customer Application

A manufacturer of electronic equipment contacted Pneumadyne engineers to discuss the liquid cooling requirements of their device. A compact manifold was needed to distribute liquid throughout seven individual cooling channels within the system. A method of connecting to a temperature probe was also required for the feedback of information to a system controller.

Application Requirements

  • Eliminate potential leak points
  • Small in size
  • Provide a heat sensor port
  • Compatible with cooling fluids

Pneumadyne’s Solution

Pneumadyne engineers developed a compact, brass manifold to accommodate the application’s size and media compatibility requirements. Each barb location contains an o-ring groove for a leak resistant connection.

  • Silicone seals for high temperatures
  • Female thread for thermo temperature probe
  • Customer part number is engraved in the block
  • O-rings located under the barb for leak resistance
  • Single-barb design for a more permanent tubing installation

Contact us today to discuss your unique application requirements.

Learn more about custom manifolds from Pneumadyne.